EMPC 2027 Call for Papers
The EMPC 2027 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.
Conference topics
Design, Modelling and Simulation
RF- and Microwave
Thermal and Thermomechanical
Manufacturability and Testability
Electronic-/Photonic-Co-Integration
2.5D and 3D-Packages
Chiplets
Materials and Processes
Substrate and Interposer Technologies
Interconnect Materials and Technologies
Assembly and Manufacturing
Material Characterisation (thermal, electrical, optical)
Nanomaterials and -technologies
Advanced Packaging and System Integration
Heterogenous Integration/2.5 and 3D Packaging
System in Package
Wafer Level Packaging (Fan In/Fan Out)
Photonics & Co-Packaged Optics
MEMS-/MOEMS-/Sensor-Packaging
RF-Packaging
Power Packaging
Quality and Reliability
Process Control
Inspection & Testing
Reliability Testing
Digital Twins
Failure Analyses
Lifetime prediction
Long Term Storage
Emerging Technologies
Packaging for AI and HPC
Quantum Devices and Applications
Sustainable Electronics and Circular Economy
Glass-Interposer Technology
Use of AI in Electronics Technology
Abstract Submission
The content must be original (previously unpublished), non-confidential and non-commercial. Maximum abstract length: 500 words. The upload of two figures is optional.
Proceedings
Accepted contributions will be published in the conference proceedings, and archived in IEEE
Xplore (provided they comply with specifications) and IMAPSource (open source). EMPC papers can be searched through IEEE, Google scholar and other search engines.
Important dates:
Conference: 14 – 16 September 2027
Abstract submission opens: 1 October 2026
Abstract submission deadline: 25 January 2027
Paper submission deadline: 31 May 2027