Welcome to EMPC 2027 in Germany!

The European Microelectronics and Packaging ­Conference (EMPC 2027) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. The EMPC 2027 Conference will again bring together the European and international packaging community.

The technical program will address current industrial needs and emerging trends alongside academic research and long-term solutions. It will provide a forum for exchanging ideas on new technologies, materials, processes and system integration approaches.

In 2027, EMPC will take place in Ingolstadt, a city near Munich shaped by engineering, technology and a strong industrial environment that combines academic research with a long tradition of advanced manufacturing in fields such as electronics, mobility, and high-performance production. This makes Ingolstadt a fitting setting for a conference focused on the technologies and packaging solutions needed for increasingly complex electronic systems.

A central part of EMPC 2027 will be the exhibition, with more than 40 companies and organizations ­expected to present technologies, products and services. It will offer participants an opportunity to discuss practical solutions and meet with suppliers and technology partners.

We look forward to seeing you in Ingolstadt!